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- Keywords electronics packaging;lead-free solder;bridging;wetting;dewetting; 电子封装;无铅钎料;桥接;润湿;去润湿;
- Keywords electronic packaging;encapsulating material;alicyclic epoxy resin;epoxization; 电子封装;电子塑封材料;脂环族环氧树脂;环氧化;
- TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
- Keywords electronic packaging;high-silicon aluminum alloy;CTE;theoretical model; 电子封装;高硅铝合金;热膨胀系数;理论模型;
- Keywords electronic packaging;molten solder droplet bumping（MSDB）;liquid-solid reaction;solid-state reaction;intermetallic compounds （IMC）; 电子封装;钎料熔滴凸点制作（MSDB）;液固反应;固态反应;界面金属间化合物;
- Keywords Electronic package;Pb-free solders;Life prediction; 电子封装;无铅焊料;寿命预测;
- Raytheon will furnish systems engineering, information assurance, maritime C4I hardware and electronics packaging, and integrated logistics support. 雷声公司将提供系统工程、信息担保、海上C4I硬件和电子包，以及综合后勤支撑。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Ellis, K.P., Vittes, F.J., and Kobza, J.E., “Optimizing the performance of a surface mount placement machine,” IEEE Transactions on Electronics Packaging Manufacturing, Vol.24, No.3, pp160-70, 2001. 张朕豪，以遗传演算法求解转塔式插件机的元件插置排序问题和料带储位安排问题，台湾大学工业工程学研究所，硕士论文，民国93年。
- The conference will feature short courses, conference keynotes, special forums and technical sessions to cover the technological developments in all the areas of electronics packaging. 会议将通过专题讲座、特邀报告、主题论坛、分会报告、论文张贴等形式对电子封装的各个技术领域中的最新进展进行交流。
- Jerry's first electronics package was the size of a small refrigerator. 杰里的第一个电子包有一个小型电冰箱那么大。
- Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
- The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
- Our HPI TX-2 radio, receiver and servos provide a reliable and trustworthy electronics package. 我们于1946德克萨斯州- 2收音机，接收器和伺服提供一个可靠的和可信赖的电子封装。
- Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. 由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。
- A new experimental technique on the CTE measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented. 在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。
- Keywords electron beam welding;focus;nonvacuum; 电子束焊接;聚焦;非真空;
- Keywords Electron beam welding（EBW） GH4169 CTOD; 电子束焊接;GH4169;裂纹尖端张开位移;
- This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 这个版本还包括涵盖新课题，如纳米技术，微机电系统，电子封装，全球气候变化，电动和混合动力汽车，生物工程。
- The Command, Control, Communications, and Intelligence (C3I) electronics packages also promote maximum flexibility for growth and upgrade. 指挥、控制、通信、情报(C3I系统)电子系统拥有很大整合作战能力，可以灵活的应对各种情况.
